Hardware Engineering Intern Summer 2025

Organization: BAE Systems—click here to apply

Application Deadline: Not specified

Overview: The BAE Systems Hardware Engineering Internship for Summer 2025 offers an immersive experience for students interested in supporting hardware development projects. Interns work on impactful tasks like building, testing, and analyzing F-16 and F-2 equipment, updating test procedures, researching hardware, and collaborating with engineering teams. This program also includes networking opportunities, team-building activities, and professional development as part of the LEAP Internship & Co-op Program.

Key Information:

  • Location: San Diego, California, United States

  • Modality: On-site

  • Compensation: $48,620–$65,670 annually (based on market, qualifications, and experience)

  • Estimated Time Commitment: Full-time, Summer 2025

Eligibility Requirements:

• Transitioning into junior or senior year during Summer 2025

• Majoring in Electrical Engineering or related field

• U.S. citizenship required

• Strong communication skills and attention to detail

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